Plasma / Reactive Ion Etch
Drytek 482 Quad Etcher
- Used for reactive ion etching of various films and deposition of carbon films/tubes
LAM 4600 Al Etcher
- Used for dry etching of aluminum metal layers
LAM 490 AutoEtch
- Used for plasma etching of silicon and silicon nitride
Trion Etcher
- Used for reactive ion etching of silicon oxide
AME P5000 Chamber C
- Used for reactive ion etching of silicon dioxide
Oxygen Plasma Strippers
Branson 3200 Asher
- Used for downstream oxygen plasma stripping of photoresist on silicon
GaSonics Aura 1000 Asher
- Used for downstream oxygen plasma stripping of photoresist on contamination threat wafers
Other Etchers
Xactic XeF2 Etcher
- Used for surface release etching silicon
STS ASE Deep Si Etcher
- Used for deep anisotropic etches of SI
Dry Etch Process Information