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The Drytek 482 Quad Etcher is set up as both a reactive ion etch and a plasma enhanced CVD system

  • Chambers 1, 2, & 3 are used for reactive ion etching of polysilicon, silicon dioxide, silicon nitride, tantalum, tungsten, and molybdenum.
  • Chamber 4 is set up as a PECVD system for depositing carbon films


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