• The DWL 66+ is a high-resolution imaging system developed to expose photoresist coatings on a variety of substrates.
    • Substrates up to 8" x  8" can be exposed.
    • Exposure wavelength is 405nm from a solid state laser.
    • The system is also the SMFL maskmaking tool.
  • Design data can be created by any program using DXF, Gerber, GDSII, or CIF format.
  • 3D structures in thick photoresist can be created by using the Advanced Gray Scale Exposure Mode.
  • Two lenses are available
    • 20mm head - 4.0um features
    • 4mm head - 0.8 um features


Tool & Process Information

Manuals & Users

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