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Facts
- The STS ASE Deep Silicon Etch is a loadlocked system.
- The process gases are C4F8, SF6, O2 and Ar.
- No metals allowed.
Personnel
- Tool Engineer - Rich Battaglia and Bruce Tolleson
- Process Engineer - Sean O'Brien
- Super User - Patricia Meller
- Any of these personnel can certify new users
Tool & Process Information
Manuals & Users
Overview
Content Tools
Please go to our SMFL Main Website
for information about