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Tool Groups

Lithography

Tool

Certification

Use

GCA Stepper

Required

5x Stepper for exposure of 100mm substrates - g-line

ASML PAS 5500/200 Stepper

Required

5x Stepper for exposure of 150mm substrates - i-line

Suss MA150 Mask Aligner

Required

1x Contact Aligner for exposure of 150mm substrates - broadband/i-line

Suss MA56 Mask Aligner

Required

1x Contact Aligner for exposure of multiple size substrates - broadband

SVG 88 Wafertrack

Required

Coat/Develop track for 100mm substrates

SSI 150 Wafertrac

Required

Coat/Develop track for 150mm substrates

CEE Resist Coater

Required

Manual Coat for photoresist only - 100/150mm

CEE Resist Developer

Required

Manual Develop for photoresist - 100/150mm

SCS 6700 Spincoater

Required

Manual Coat for SU8 / Polyimides / SOG -multiple sizes

Physical Vapor Deposition

Tool

Certification

Use

CVC 601 Sputter

Required

DC sputter of metals / conducting targets

PE2400A RF Sputter

Required

RF Sputter of conducting and insulating targets

PE4400 RF Loadlock Sputter

Required

RF Sputter of conducting and insulating targets, loadlocked

CHA Ebeam Evaporator

Required

Eight pocket electron beam evaporation

CHA Flash Evaporator

Required

Flash evaporation of Al wire

CVC Thermal Evaporator

Required

Thermal evaporation

Nanomaster NSC 2000

Required

Sputter Deposition

Denton Sputter

Required

Sputtering of gold on SEM samples

Anatech Sputter

Required

Sputtering of carbon on SEM samples

Dry Etch

Tool

Certification

Use

Drytek Quad

Required

Reactive Ion Etch of silicon dioxide, silicon nitride, molybdenum, polysilicon, tantulum, tungsten, deposition of carbon films/tubes

LAM 4600 Al Etcher

Required

Used for dry etching of aluminum metal layers

LAM 490 AutoEtch

Required

Plasma Etch of silicon and silicon nitride

AME P5000 Chamber C

Required

Reactive Ion Etching of silicon dioxide

Trion Reactive Ion Etcher

Required

Used for reactive ion etching of silicon & silicon nitride

Branson Asher

Required

Used for downstream oxygen plasma stripping of photoresist on silicon

GaSonics Aura 1000 Asher

Required

Used for oxygen plasma stripping of photoresist on contamination threat wafers

STS ASE Deep Silicon Etcher

Required

Deep silicon etching using the Bosch Process

Xactic XeF Etcher

Required

Used for surface release etching of silicon

Thermal & Implant

Tool

Certification

Use

AG 610A RTP

Required

Rapid Thermal Anneal of clean, MOS grade wafers

Bruce Tube 1

Required

Used for wet oxidation of silicon substrates

Bruce Tube 2

Required

Used for diffusion of p-type dopants

Bruce Tube 3

Required

Used for diffusion of n-type dopants

Bruce Tube 4

Required

Used for dry oxidation of silicon substrates

Bruce Tube 5

Required

Fitted with external torch for low temp wet oxide growth

Bruce Tube 6

Required

Used for wet oxidation of silicon substrates

Bruce Tube 7

Required

Used for low temperature anneals

Bruce Tube 8

Required

Used for high temperature anneals - Contamination threat substrates

Varian 350D Implanter

Required

Used for implantation of boron and phosphorous

Heraeus Vacuuum Oven

Required

Used for heat treatment of substrates under vacuum

Blue M Ovens

Not Required

Used for heat treatment of substrates

Wet Chemical Process

Tool

Certification

Use

Al Etch & Solvent Strip Bench

Required

Tank for aluminum etching & two tanks for solvent strip of photoresist.

BOE & HF Wet Bench

Required

Wet Bench with tanks for BOE, Pad Etch, & HF etching of oxides.

General RCA Bench

Required

Used for RCA Clean of wafers

Manual Processing #1 Wet Bench

Required

Used for general purpose manual chemical processing

Manual Processing #2 Wet Bench

Required

Used for general purpose manual chemical processing & HCl Decontamination

Manual Processing #3 Wet Bench

Required

Used for general purpose manual chemical processing

Manual Processing #4 Wet Bench

Required

Used for general purpose manual chemical processing

MOS RCA Bench

Required

Used for RCA Clean of wafers before gate oxidation

Nitride & Silicon Etch Bench

Required

Etching of Nitride with heated phosphoric and silicon etching with heated KOH

Ultrasonic Wet Bench

Required

Used for the ultrasonic cleaning of silicon wafers - also used in liftoff processes.

Chemical Vapor Deposition

Tool

Certification

Use

ASM LPCVD Tube 1

Required

LPCVD Low Temperature Oxide

ASM LPCVD Tube 2

Required

LPCVD Nitride, Polysilicon

AME P5000 Chamber A

Required

4" and 6" TEOS at 390C

AME P5000 Chamber B

Required

4" and 6" PECVD Nitride at 400C

SMFL Parylene

Required

Parylene deposition system

Drytek Chamber 4

Required

Diamond Like Carbon Deposition

Metrology

Tool

Certification

Use

Leitz Inspection Station

None

Optical linewidth measurement

Leica Inspection Station

None

Optical microscope with image capture

Olympus Microscope Station

None

Optical microscope with Nomarski

Nanometrics Spectrophotometer

None

Measurement of oxide, nitride

Prometrix SpectraMap

Required

Measurement of oxide, nitride

Rudolph AutoEL IV Ellipsometer

Required

Ellipsometry of thin films

Tencor Surfscan 364

Required

Measurement of particulate using rastered laser scatter

Woollam VASE

Required

Ellipsometry using variable angle, multi spectral

Wyko Dynamic Optical Profiler

Required

Dynamic measurement of step heights using interferometry

CDE Res Map

Required

Measurement of film resistivity

Tencor P2

Required

Profilometer measurement of film steps

Amray 1830 SEM

Required

Scanning electron microscope

CMP & Dicing

Tool

Certification

Use

Strausbaugh CMP

Required

Basic CMP tool used for metal polishing

Ecomet Grinder

Required

Rotating platen tool used with abrasive sheets for thinning substrates

Kulicke & Soffa 780 Dicing Saw

Required

Dicing saw for cutting 150mm substrates into smaller rectangular pieces

Tempress Dicing Saw

Required

Dicing saw for cutting 100mm substrates into smaller rectangular pieces

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