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Ethyl Lactate
  • Common solvent found in many photoresists. This chemical replaced cellusolve acetate as a safer solvent for photoresists.
  • Used as an edge bead remover in photoresist processing.
  • Main solvent in FujiFilm OiR620-10M Photoresist and FujiFilm HPR504 Photoresist
HMDS
  • Hexamethyldisilazane
  • HMDS is an organic, flammable solvent and is used to treat substrate surfaces prior to photoresist coating (primarily positive resist).
  • When an organic photoresist with a high surface tension is coated over a hydrophilic, low surface tension surface (such as silicon dioxide), dewetting and adhesion problems can occur. Exposure of the low surface tension substrate surface with HMDS will chemically convert the surface to raise it's surface tension to match the organic photoresist.
  • Over exposure to the HMDS can also result in adhesion problems.
  • In the automatic coat/develop tracks, it is used in full strength.
  • On the manual spin coaters, a diluted version is used (MicroPrime MP-P20 ).

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Material that is coated under photoresist to provide a undercut layer for liftoff processes.  The S

PGMEA
  • Full chemical name is Propylene Glycol Methyl Ether Acetate.
  • Common solvent found in many photoresists. Replaced cellusolve acetate as a safer solvent for photoresists.
  • Used as an edge bead remover in photoresist processing.
Polyimide
  • Polyimide is an organic compound consisting of repeating imide molecules.
  • Polyimides are used in different industries but have the characteristics of thermal stability, good chemical resistance, excellent mechanical properties. Kapton and Vespel are two examples of polyimide formulations
  • It is used in the semiconductor industry to take advantage of these properties in a variety of applications.
  • Usually formulated as a spin on material that can be set up a positive or negative acting photoresist. Very thick films can be deposited - 10's of microns.
MIR-701 Photoresist
  • General purpose high resolution resist - 14cPs viscosity
  • Sensitive at 436nm and 365 nm
S1800 Series Broadband Photoresist
  • General purpose, broadband photoresist
SU8
  • An epoxy based, chemically amplified, negative acting photoresist.
  • Cured films are highly resistant to solvents, acids and bases and have excellent thermal stability
  • Well suited for permanent use applications.

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