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Comment: Migrated to Confluence 4.0

CMP

Strausbaugh

  • Basic CMP tool used for metal polishing

Wafer Grinding / Polishing

Ecomet Grinder

  • Rotating platen tool used with abrasive sheets for thinning substrates

Dicing

Kulicke & Soffa 780 Dicing Saw

  • Dicing saw for cutting 150mm substrates into smaller rectangular pieces.

Tempress Dicing Saw

  • Dicing saw for cutting 100mm substrates into smaller rectangular pieces.