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  • Used in the development of many photoresists. In the SMFL it is used primarily to develop the OiR 620M and HPR 504 materials504 positive photoresists.
  • Based on Tetramethyl Ammonium Hydroxide or TMAH
  • (warning) Please see the warnings on TMAH. It is toxic and there is no antidote.

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  • Common solvent found in many photoresists. This chemical replaced cellusolve acetate as a safer solvent for photoresists.
  • Used as an edge bead remover in photoresist processing.
  • Main solvent in FujiFilm OiR620-10M Photoresist and FujiFilm HPR504 Photoresist

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  • General purpose, broadband photoresist

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  • Hexamethyldisilazane
  • HMDS is an organic, flammable solvent and is used to treat substrate surfaces prior to photoresist coating (primarily positive resist).
  • When an organic photoresist with a high surface tension is coated over a hydrophilic, low surface tension surface (such as silicon dioxide), dewetting and adhesion problems can occur. Exposure of the low surface tension substrate surface with HMDS will chemically convert the surface to raise it's surface tension to match the organic photoresist.
  • Over exposure to the HMDS can also result in adhesion problems.
  • In the automatic coat/develop tracks, it is used in full strength.
  • On the manual spin coaters, a diluted version is used (MicroPrime MP-P20 ).


LOR Liftoff Photoresist

Material that is coated under photoresist to provide a undercut layer for liftoff processes

OiR 62M i-line Photoresist
  • High resolution i-line positive photoresist for submicron features
P20
  • A diluted version of HMDS used for adhesion promotion when manual dispensing
  • Manufactured by Shin-Etsu MicroSi- Product name is MicroPrime MP-P20
  • Composition is 20% HMDS, 80% PGMEA

PGMEA
  • Full chemical name is Propylene Glycol Methyl Ether Acetate.
  • Common solvent found in many photoresists. Replaced cellusolve acetate as a safer solvent for photoresists.
  • Used as an edge bead remover in photoresist processing.

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  • Polyimide is an organic compound consisting of repeating imide molecules.
  • Polyimides are used in different industries but have the characteristics of thermal stability, good chemical resistance, excellent mechanical properties. Kapton and Vespel are two examples of polyimide formulations
  • It is used in the semiconductor industry to take advantage of these properties in a variety of applications.
  • Usually formulated as a spin on material that can be set up a positive or negative acting photoresist. Very thick films can be deposited - 10's of microns.


S1800 Series Broadband Photoresist
  • General purpose, broadband photoresist
SU8
  • An epoxy based, chemically amplified, negative acting photoresist.
  • Cured films are highly resistant to solvents, acids and bases and have excellent thermal stability
  • Well suited for permanent use applications.

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  • SMFL incoming solution is 38%.
  • Used in the RCA Clean process
  • Used for decontamination clean after Potassium Hydroxide (KOH) etches.

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Phosphoric Acid
  • Basic component of Aluminum etchants.
  • SMFL incoming solution is 85%.
  • Used for other etching & etchant mixtures. Hot phosphoric acid is used for silicon nitride etching.

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  • Caution - treat as if this chemical were Hydrofluoric Acid - Poses similar risks.
  • Pad Etch is an ammonium fluoride mixture used to etch oxide that has been deposited over aluminum.
  • Once through the oxide, the pad etch will not harm the underlying Al as quickly as an HF etch would.
  • Is manufactured in formulations with and without surfactants.

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Ammonium Hydroxide
  • Used in the RCA Clean process
  • SMFL incoming solution is 29%.

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  • Acronym for N-Methyl-2-pyrrolidone
  • Common component of many photoresist strippers such as Remover PG and PRS-2000

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  • NMP based solvent photoresist stripper manufactured by Baker Mallinckrodt

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Remover PG
  • NMP based solvent stripper.
  • Primarily used to remover SU8 & LOR 5A, 10A Liftoff Photoresist materials
  • Tools
    • Used at the Manual Processing Wetbenches

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Other

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  • Use with caution! Very strong oxidizer
  • Hydrogen peroxide decomposes to form water and oxygen. The decomposition rate varies with temperature, contaminants and pH (higher temp and higher pH speed up the process)
  • Hydrogen peroxide must be stored in properly vented containers.
  • Used in the making of Piranha Clean and in the RCA Clean process

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*Boron trichloride is used in the aluminum dry etch process. It etches the native Al2O3 layer so that the chlorine can etch the aluminum.

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  • Chloroform is used in the dry etching of aluminum. It is used in the formation of polymer sidewalls to give anisotropic etch profiles.
  • Chemical formula is CHCl3.

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  • Chlorine is used for dry etching of aluminum.

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  • Chemical formula is NH3
  • At room temperature, ammonia is a gas with very pungent odor.
  • Used in conjunction with Dichlorosilane to grow silicon nitride

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  • Chemical formula is H2SiCl2 - or known by the acronym of DCS
  • DCS is mixed with [ |ammonia Ammonia (NH3) |Listing of Chemistry#Ammonia] in LPCVD chambers to grow silicon nitride

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  • Chemical formula is SiH4
  • At room temperature, silane is a gas, and is pyrophoric
  • Used as a source of silicon for the growth of polysilicon in LPCVD.

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