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Tool

Certification

Use

LAM 4600 Al Etcher

Required

Used for dry etching of aluminum metal layers - chlorine

LAM 490 AutoEtch

Required

Plasma Etch of silicon and silicon nitride

AME P5000 Chamber C

Required

Reactive Ion Etching of silicon dioxide

Plasmatherm ICP EtchRequiredUsed for dry etching of III-V substrates - chlorine

Trion Minilock Reactive Ion Etcher

Required

Used for reactive ion etching of silicon & silicon nitride

Trion Phantom III Reactive Ion EtcherRequiredUsed for reactive ion etching of silicon & silicon nitride
Trion ICP Reactive Ion EtcherRequired
STS ASE Deep Silicon Etcher

Required

Deep silicon etching using the Bosch Process

Xactic XeF Etcher

Required

Used for surface release etching of silicon

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Tool

Certification

Use

ASM LPCVD Tube 1

Required

LPCVD Low Temperature Oxide

ASM LPCVD Tube 2

Required

LPCVD Nitride, Polysilicon

AME P5000 Chamber A

Required

4" and 6" TEOS at 390C

AME P5000 Chamber B

Required

4" and 6" PECVD Nitride at 400CTEOS on contamination threat substrates

Trion PECVDRequiredDeposition of nitride/poly Si on III-V substrates
Ultratech S200 ALDRequiredDeposition of atomic layer films

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