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Pricing Information

Information on the hourly rates for SMFL tools and mask prices

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SMFL Services and Capabilities

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  • Complete prototyping of devices and systems with help from the electrical and surface analytical characterization labs, microelectronics layout and computer simulation facilities, and in-house industry-standard electronics packaging capability.

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The SMFL offers a wide range of services from single process up to foundry services.
: It is by no means a complete list, please contact us so that we can discuss your needs.

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Foundry Services

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The SMFL has a 2um CMOS process with an effective L of 1.5um.

  • We have run this process for customers using their design and incorporating our test structure for test verification.
  • Aluminum and Tungsten gate metals have been processed - others are possible.
  • Our Vt's are well matched but implant splits are possible.
  • We are currently putting together a page with more details including
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  • Spice model parameters
    **Test results of last lot run - 4/12
  • Overview of the SMFL test chip with details on specific devices
  • Typical run time is ~8 weeks

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Details about the SMFL CMOS Process, Performance, Specifications, and Options

If you require this information or a quote on your process, please contact T. Grimsley

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Scanning Electron Microscopy

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There are several SEMs available for imaging a variety of samples.
:Amray 1830 LaB6 system
:LEO EVO 50 LaB6 system. Contact Sean Rommel of RIT's Electrical and Microelectronic engineering Department about this tool. 

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Film Thickness - Ellipsometry :

  • Woollam VASE with Autoretarder operating at wavelengths from 240-1700nm and variable angle of incidence.

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Film Thickness - Profilometry :

  • Tencor P2 is a long length scanning profilometer useful for measuring step heights.

Film Thickness - Optical :

Resistivity Measurements' :

  • CDE Res Map provides sheet resistance and resistivity mapping of silicon wafers and films.
Thin Film Deposition

Sputter Deposition :

  • The SMDL has a variety of DC and RF deposition tools. The

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  • PE 4410 is loadlocked and has sputter etch capability.

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  • A wide variety of targets exist in bonded 8" form and unbonded 4" targets for the sputter head on the

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        • Al/Si, Ti, Cr, W/Ti, Cu, Mo, Ta - 8" bonded, water cooled targets

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        • Cu, Ti, Ni, Cr, Ge, InSn, Mo, NiCr - 4" target for sputter head

      Thermal Evaporation :

      • The SMFL has

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      • two thermal evaporators - one is a basket style for various metals and the other is a flash evaporator for deposition of aluminum.

      Electron Beam Evaporation
      The SMFL has a [CHA _ Ebeam _ Evaporator] with a 3KV electron beam gun with an eight pocket carousel.

      Plasma Enhanced Chemical Vapor Deposition (PECVD)
      The SMFL has a an Applied Materials P5000 systems equipped with two deposition chambers :[AME_P5000_Chamber_A ]

      • TEOS Oxide from a few nanometers to many microns can be deposited

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      Low Pressure Chemical Vapor (LPCVD) :

      • Our

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      • system is capable of depositing Nitride, Poly and Low Temp Oxide.

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      Short Courses

      The SMFL has run hands on courses in Cleanroom Etiquette, MEMS Processing, and Thin Films.

      We can can custom tailor a course to suit the needs of your organization. Please contact us and we can discuss your requirements.

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      A complete listing of all of the Tools in the SMFL can be found here