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  • Listed below are chemicals that can be found in the SMFL . Some that are available for general use and some belong to specific research projects. 
  • There are chemicals in the cleanroom that do not belong to the SMFL. Permission from the owner is required before use. They will be marked with the owner's name.

(warning) (warning) If the chemical you need is not on this list, it must be signed off by the SMFL first before it comes into the facility!

  • This information is not intended to be the ultimate source for safety information, merely a starting point.
  • Wikipedia entries are used for general reference and should never be sited as real sources. We have only linked to the more complete entries.

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Lithographic Chemicals

CD 26 Developer
  • Used in the development of many photoresists. In the SMFL it is used primarily to develop the OiR 620M and HPR 504 materials504 positive photoresists.
  • Based on Tetramethyl Ammonium Hydroxide or TMAH
  • (warning) Please see the warnings on TMAH. It is toxic and there is no antidote.
  • NFPA Ratings - Health - 3 Flammability - 0 Reactivity - 0

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Ethyl Lactate

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*Common solvent found in many photoresists. Replaced cellusolve acetate as a safer solvent for photoresists.
*Used as an edge bead remover in photoresist processing.
*Main solvent in FujiFilm [SMFL Chemistry#OiR 620M i-line Photoresist] and FujiFilm [SMFL Chemistry#HPR504 Broadband Photoresist ]

*References
**http://en.wikipedia.org/wiki/Ethyl_lactate Wikipedia Entry for Ethyl Lactate
**http://www.smfl.rit.edu/pdf/msds/msds_BTS_280.pdf MSDS for Ethyl Lactate

*NFPA Ratings <font color="blue">'''Health - 2 </font>/<font color="red"> Flammability - 2 </font>/ <font color="orange"> Reactivity - 0''' </font>

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HPR504 Broadband Photoresist

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*General purpose, broadband [Definitions#Photoresist ]

*Tools
**''Used in [SVG Track ]''
**''Used in [CEE Resist Spinner ]''
**''Used in [SCS Resist Coater ]''

*References
**Manufactured by http://www.fujifilm-ffem.com FujiFilm
**http://www.smfl.rit.edu/pdf/productinfo/Productinfo_HPR_500.pdf HPR 504 Data Sheet
**Can be used in a [Lift_Off_Process ]
**http://www.smfl.rit.edu/pdf/msds/msds_HPR_504.pdf Material Safety Data Sheet for HPR 504

*NFPA Ratings <font color="blue">'''Health - 1 </font>/<font color="red"> Flammability - 2 </font>/ <font color="orange"> Reactivity - 1''' </font>

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HMDS

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HMDS
  • Hexamethyldisilazane
  • Poses a serious safety concern - toxic if inhaled.
  • HMDS is an organic, flammable solvent and is used to treat substrate surfaces prior to photoresist coating (primarily positive resist).

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  • When an organic photoresist with a high surface tension is coated over a hydrophilic, low surface tension surface (such as silicon dioxide), dewetting and adhesion problems can occur. Exposure of the low surface tension substrate surface with HMDS will chemically convert the surface to raise it's surface tension to match the organic photoresist.

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  • Over exposure to the HMDS can also result in adhesion problems.

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