Versions Compared

Key

  • This line was added.
  • This line was removed.
  • Formatting was changed.

...

  • Listed below are chemicals that can be found in the SMFL . Some that are available for general use and some belong to specific research projects. 
  • There are chemicals in the cleanroom that do not belong to the SMFL. Permission from the owner is required before use. They will be marked with the owner's name.

...

  • Used in the development of many photoresists. In the SMFL it is used primarily to develop the OiR 620M and HPR 504 positive photoresists.
  • Based on Tetramethyl Ammonium Hydroxide or TMAH
  • (warning) Please see the warnings on TMAH. It is toxic and there is no antidote.
Ethyl Lactate
  • Common solvent found in many photoresists. This chemical replaced cellusolve acetate as a safer solvent for photoresists.
  • Used as an edge bead remover in photoresist processing.
  • Main solvent in FujiFilm OiR620-10M Photoresist and FujiFilm HPR504 Photoresist
HMDS

...

HMDS
  • Hexamethyldisilazane
  • Poses a serious safety concern - toxic if inhaled.
  • HMDS is an organic, flammable solvent and is used to treat substrate surfaces prior to photoresist coating (primarily positive resist).
  • When an organic photoresist with a high surface tension is coated over a hydrophilic, low surface tension surface (such as silicon dioxide), dewetting and adhesion problems can occur. Exposure of the low surface tension substrate surface with HMDS will chemically convert the surface to raise it's surface tension to match the organic photoresist.
  • Over exposure to the HMDS can also result in adhesion problems.
  • In the automatic coat/develop tracks, it is used in full strength.
  • On the manual spin coaters, a diluted version is used (MicroPrime MP-P20 ).
  • Tools


LOR Liftoff Photoresist

Material that is coated under photoresist to provide a undercut layer for liftoff processes.  The S

P20

...

PGMEA
  • Full chemical name is Propylene Glycol Methyl Ether Acetate.
  • Common solvent found in many photoresists. Replaced cellusolve acetate as a safer solvent for photoresists.
  • Used as an edge bead remover in photoresist processing.
Polyimide
  • Polyimide is an organic compound consisting of repeating imide molecules.
  • Polyimides are used in different industries but have the characteristics of thermal stability, good chemical resistance, excellent mechanical properties. Kapton and Vespel are two examples of polyimide formulations
  • It is used in the semiconductor industry to take advantage of these properties in a variety of applications.
  • Usually formulated as a spin on material that can be set up a positive or negative acting photoresist. Very thick films can be deposited - 10's of microns.
MIR-701 Photoresist
  • General purpose high resolution resist - 14cPs viscosity
  • Sensitive at 436nm and 365 nm
S1800 Series Broadband Photoresist
  • General purpose, broadband photoresist
SU8
  • An epoxy based, chemically amplified, negative acting photoresist.
  • The SMFL has some SU8 available - please check to see which formulations are on hand
  • Cured films are highly resistant to solvents, acids and bases and have excellent thermal stability
  • Well suited for permanent use applications.

...

...

Parylene

Parylene is a polymer that when heated under low pressure will deposit on surfaces.

  • It has good coating properties and is used in a variety of applications in MEMs, Bio-MEMs, & semiconductor applications
Spin on Glass

Spin on glass is a generic term that describes a variety of compounds.

...

Tetrafluoromethane

...

...

...