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  • This information is not intended to be the ultimate source for safety information, merely a starting point

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  • Used in the development of many photoresists. In the SMFL it is used primarily to develop the OiR 620M and HPR 504 positive photoresists.
  • Based on Tetramethyl Ammonium Hydroxide or TMAH
  • (warning) Please see the warnings on TMAH. It is toxic and there is no antidote.

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  • Hexamethyldisilazane
  • HMDS is an organic, flammable solvent and is used to treat substrate surfaces prior to photoresist coating (primarily positive resist).
  • When an organic photoresist with a high surface tension is coated over a hydrophilic, low surface tension surface (such as silicon dioxide), dewetting and adhesion problems can occur. Exposure of the low surface tension substrate surface with HMDS will chemically convert the surface to raise it's surface tension to match the organic photoresist.
  • Over exposure to the HMDS can also result in adhesion problems.
  • In the automatic coat/develop tracks, it is used in full strength.
  • On the manual spin coaters, a diluted version is used (MicroPrime MP-P20 ).

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  • General purpose high resolution resist - 14cPs viscosity
  • Sensitive at 436nm and 365 nm
S1800 Series Broadband Photoresist

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