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  • Listed below are chemicals that can be found in the SMFL . Some that are available for general use and some belong to specific research projects. 
  • There are chemicals in the cleanroom that do not belong to the SMFL. Permission from the owner is required before use. They will be marked with the owner's name.

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  • Used in the development of many photoresists. In the SMFL it is used primarily to develop the OiR 620M and HPR 504 positive photoresists.
  • Based on Tetramethyl Ammonium Hydroxide or TMAH
  • (warning) Please see the warnings on TMAH. It is toxic and there is no antidote.
HMDS
  • Hexamethyldisilazane
  • Poses a serious safety concern - toxic if inhaled.
  • HMDS is an organic, flammable solvent and is used to treat substrate surfaces prior to photoresist coating (primarily positive resist).
  • When an organic photoresist with a high surface tension is coated over a hydrophilic, low surface tension surface (such as silicon dioxide), dewetting and adhesion problems can occur. Exposure of the low surface tension substrate surface with HMDS will chemically convert the surface to raise it's surface tension to match the organic photoresist.
  • Over exposure to the HMDS can also result in adhesion problems.
  • In the automatic coat/develop tracks, it is used in full strength.
  • On the manual spin coaters, a diluted version is used (MicroPrime MP-P20 ).
  • Tools


LOR Liftoff Photoresist

Material that is coated under photoresist to provide a undercut layer for liftoff processes.  The S

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  • An epoxy based, chemically amplified, negative acting photoresist.
  • The SMFL has some SU8 available - please check to see which formulations are on hand
  • Cured films are highly resistant to solvents, acids and bases and have excellent thermal stability
  • Well suited for permanent use applications.

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