**Basic CMP tool used for metal polishing
===Wafer Grinding / Polishing===
**Rotating platen tool used with abrasive sheets for thinning substrates
**Basic CMP tool used for polishing a variety of substrates
ADT Dicing Saw] **
**Dicing saw for cutting 100mm substrates into smaller rectangular pieces.
*'''[SBT Wire Saw]
**A small saw that uses a diamond impregnated wire for (or metal wire with slurry) for dicing smaller substrates.