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  • The Suss MA150 Contact Aligner is a 1x aligner.
  • The mask is brought into close contact with the substrate
    • The features on the mask are printed at the intended size for on the substrate - 1x designation.
    • The gap can be made larger for 'sticky' resists - subsequent loss of high frequency information - square corners become rounded.
    • Uses 5" x 5" x 0.09" or 6" x 6" x 0.09" soda lime photomasks.
    • 5" & 6" masks are held in special vacuum holders for use with 150mm wafers.
  • Cassette to cassette wafer handling
  • Capable of features down to 2um in size
  • It is configured for 150mm wafers and uses the mercury broadband for exposure.
  • It also has an i-line filter for defining smaller features.