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  • The Suss 56 Contact Aligner is a 1x aligner.
  • The mask is brought into close contact with the substrate.
    • The features on the mask are printed at the intended size for on the substrate - 1x designation.
    • The gap can be made larger for 'sticky' resists - subsequent loss of high frequency information - square corners become rounded.
    • Uses 5" x 5" x 0.09" soda lime photomasks.

*Capable of features down to 2um in size

*It is has chucks for a variety of wafer / substrate sizes and uses the mercury broadband for exposure.

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Tool & Process Information

Manuals & Users