- Basic CMP tool used for metal polishing
Wafer Grinding / Polishing
*'''[Ecomet Grinder] **
- Rotating platen tool used with abrasive sheets for thinning substrates
*'''[SBT 920 Polisher] **
- Basic CMP tool used for polishing a variety of substrates
Kulicke & Soffa 780 Dicing Saw ] **
- Dicing saw for cutting 150mm substrates into smaller rectangular pieces.
**Tempress Dicing Saw
- Dicing saw for cutting 100mm substrates into smaller rectangular pieces.
*'''[SBT 820 Wire Saw ] **
- A small saw that uses a diamond impregnated wire for (or metal wire with slurry) for dicing smaller substrates.