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CMP

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*'''[Strausbaugh] **

  • Basic CMP tool used for metal polishing

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Wafer Grinding / Polishing

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*'''[Ecomet Grinder] **

  • Rotating platen tool used with abrasive sheets for thinning substrates

*'''[SBT 920 Polisher] **

  • Basic CMP tool used for polishing a variety of substrates

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Dicing

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Kulicke & Soffa 780 Dicing Saw ] **

  • Dicing saw for cutting 150mm substrates into smaller rectangular pieces.

*'''[Tempress]
**Tempress Dicing Saw

  • Dicing saw for cutting 100mm substrates into smaller rectangular pieces.

*'''[SBT 820 Wire Saw ] **

  • A small saw that uses a diamond impregnated wire for (or metal wire with slurry) for dicing smaller substrates.