CMP
Strausbaugh
- Basic CMP tool used for metal polishing
Wafer Grinding / Polishing
Ecomet Grinder
- Rotating platen tool used with abrasive sheets for thinning substrates
Dicing
Kulicke & Soffa 780 Dicing Saw
- Dicing saw for cutting 150mm substrates into smaller rectangular pieces.
Tempress Dicing Saw
- Dicing saw for cutting 100mm substrates into smaller rectangular pieces.