CMP
- Basic CMP tool used for metal polishing
Wafer Grinding / Polishing
- Rotating platen tool used with abrasive sheets for thinning substrates
Dicing
Kulicke & Soffa 780 Dicing Saw
- Dicing saw for cutting 150mm substrates into smaller rectangular pieces.
- Dicing saw for cutting 100mm substrates into smaller rectangular pieces.
Overview
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