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**Basic CMP tool used for metal polishing

===Wafer Grinding / Polishing===

*'''[Ecomet Grinder]
**Rotating platen tool used with abrasive sheets for thinning substrates

*'''[SBT Polisher]
**Basic CMP tool used for polishing a variety of substrates


*'''[KS780 Dicing Saw]
**Dicing saw for cutting 150mm substrates into smaller rectangular pieces.

**Dicing saw for cutting 100mm substrates into smaller rectangular pieces.

*'''[SBT Wire Saw]
**A small saw that uses a diamond impregnated wire for (or metal wire with slurry) for dicing smaller substrates.

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