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SMFL Services and Capabilities

The capabilities of the SMFL include:

  • Wafer cleaning, ion implantation and diffusion, and high temperature processing both with conventional tube furnaces and RTP systems.
  • CVD / PECVD deposition capabilities are available for oxides, nitrides, and polysilicon. A variety of vacuum systems are available for sputtering and thermal evaporation of metals and dielectrics.
  • Lithography, including automated coating and development systems combined with a set of two 5:1 steppers with capabilities down to 0.40 microns, as well as 1:1 contact lithography and an electron beam exposure system for photo mask production.
  • Plasma etch capabilities for silicon, oxides, nitrides, and metals and provision for a broad variety of wet chemical etch processes as well as copper electroplating and CMP.
  • Complete prototyping of devices and systems with help from the electrical and surface analytical characterization labs, microelectronics layout and computer simulation facilities, and in-house industry-standard electronics packaging capability.

The SMFL offers a wide range of services from single process up to foundry services.
It is by no means a complete list, please contact us so that we can discuss your needs.

Foundry Services

The SMFL has a 2um CMOS process with an effective L of 1.5um.

  • We have run this process for customers using their design and incorporating our test structure for test verification.
  • Aluminum and Tungsten gate metals have been processed - others are possible.
  • Our Vt's are well matched but implant splits are possible.

  • We are currently putting together a page with more details including
    • Spice model parameters
      **Test results of last lot run - 4/12
    • Overview of the SMFL test chip with details on specific devices
      ** Typical run time is ~8 weeks

If you require this information or a quote on your process, please contact T. Grimsley

Single Process Services


Scanning Electron Microscopy


There are several SEMs available for imaging a variety of samples.
:Amray 1830 LaB6 system
:LEO EVO 50 LaB6 system. Contact Sean Rommel of RIT's Electrical and Microelectronic engineering Department about this tool.

Film Thickness - Ellipsometry
:Woollam VASE with Autoretarder operating at wavelengths from 240-1700nm and variable angle of incidence.
:Rudolph Auto EL IV operating at three wavelengths

Film Thickness - Profilometry
:Tencor P2 is a long length scanning profilometer useful for measuring step heights.

Film Thickness - Optical
:Prometrix SpectraMap SM300 and two Nanometrics Spectrophotometers that provide noncontact optical film thickness measurement mapping - Resist, oxide, nitride.

Resistivity Measurements'
:CDE Res Map provides sheet resistance and resistivity mapping of silicon wafers and films.

Thin Film Deposition

Sputter Deposition
: The SMDL has a variety of DC and RF deposition tools. The [[PE4400_Sputter ]] is loadlocked and has sputter etch capability.
: A wide variety of targets exist in bonded 8" form and unbonded 4" targets for the sputter head on the [[CVC_601_Sputter ]].
::Al/Si, Ti, Cr, W/Ti, Cu, Mo, Ta - 8" bonded, water cooled targets
::Cu, Ti, Ni, Cr, Ge, InSn, Mo, NiCr - 4" target for sputter head

Thermal Evaporation
:The SMFL has [[Physical_Vapor_Deposition ]] - one is a basket style for various metals and the other is a flash evaporator for deposition of aluminum.

Electron Beam Evaporation
The SMFL has a [[CHA_Ebeam_Evaporator ]] with a 3KV electron beam gun with an eight pocket carousel.

Plasma Enhanced Chemical Vapor Deposition (PECVD)
The SMFL has a Applied Materials P5000 systems equipped with two deposition chambers
:[[AME_P5000_Chamber_A ]] from a few nanometers to many microns can be deposited
:[[AME_P5000_Chamber_B ]] can also be deposited.

Low Pressure Chemical Vapor (LPCVD)
:Our [[ASM_LPCVD_Tube_1 ]] system is capable of depositing Nitride, Poly and Low Temp Oxide.
:We also has an [[SMFL_Parylene ]] deposition system

A complete listing of all of the Tools in the SMFL can be found here

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