- Basic CMP tool used for metal polishing
Wafer Grinding / Polishing
- Rotating platen tool used with abrasive sheets for thinning substrates
SBT 920 Polisher
- Basic CMP tool used for polishing a variety of substrates
Kulicke & Soffa 780 Dicing Saw
- Dicing saw for cutting 150mm substrates into smaller rectangular pieces.
Tempress Dicing Saw
- Dicing saw for cutting 100mm substrates into smaller rectangular pieces.
SBT 820 Wire Saw
- A small saw that uses a diamond impregnated wire for (or metal wire with slurry) for dicing smaller substrates.