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CMP

Strausbaugh

  • Basic CMP tool used for metal polishing

Wafer Grinding / Polishing

Ecomet Grinder

  • Rotating platen tool used with abrasive sheets for thinning substrates

SBT 920 Polisher

  • Basic CMP tool used for polishing a variety of substrates

Dicing

Kulicke & Soffa 780 Dicing Saw

  • Dicing saw for cutting 150mm substrates into smaller rectangular pieces.

Tempress Dicing Saw

  • Dicing saw for cutting 100mm substrates into smaller rectangular pieces.

SBT 820 Wire Saw

  • A small saw that uses a diamond impregnated wire for (or metal wire with slurry) for dicing smaller substrates.
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