Some Important Information

(warning) If the chemical you need is not on this list, it must be signed off by the SMFL first before it comes into the facility!


Lithographic Chemicals

CD 26 Developer
Ethyl Lactate


HMDS


LOR Liftoff Photoresist

Material that is coated under photoresist to provide a undercut layer for liftoff processes

PGMEA


Polyimide
MIR-701 Photoresist
S1800 Series Broadband Photoresist
SU8

Acids

Ammonium Fluoride
Hydrochloric Acid
Hydrofluoric Acid
Nitric Acid
Phosphoric Acid
Sulfuric Acid

Specialty Etches

Aluminum Etch
Buffered Oxide Etch (BOE)
Freckle Etch
Pad Etch

Bases

Potassium Hydroxide
Ammonium Hydroxide
Tetramethyl Ammonium Hydroxide

Solvents / Strippers

NMP
PRS 2000
Remover PG

Other

Hydrogen Peroxide
Spin on Glass

Spin on glass is a generic term that describes a variety of compounds.


Dry Etch Gases

Boron Trichloride

Boron Trichloride is highly toxic.

*Boron trichloride is used in the aluminum dry etch process. It etches the native Al2O3 layer so that the chlorine can etch the aluminum.

Chloroform
Chlorine

Chlorine is highly toxic, corrosive, and a strong oxidizer.

Sulfur Hexafluoride
Tetrafluoromethane
Trifluoromethane
Xenon Difluoride

Deposition Gases

Ammonia
Dichlorosilane

Dichlorosilane is highly flammable and toxic

Silane
Tetraethyl Orthosilicate